International Conference on Engineering Technology,Computing, and Smart Materials (ETCSM-APRIL-2022)

The Conference organizing committee invites Scholars /Scientists / Engineers/ Researchers / Practitioners / Students worldwide to submit papers and share the valuable experiences on this platform.

All submitted abstracts/ papers / posters will go through a blind peer review process and accepted manuscripts will be published in ISBN: 9979-53-7912-6 conference proceedings. Accepted manuscripts are published in ISBN conference proceedings. Conference proceeding are submitted to Indexation agencies.

All selected conference papers will be published free of cost in our associated journals that are having unique ISSN and Published on quarterly basis. These journals are indexed by:

Google Scholar
CrossRef
Doi System

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